scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 SG1644 Dual high speed driver

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-TI4 or CDIP2-T14 14 Dual-in-line G MACY1-X8 8 Can p GDIPl-T8 or CDIP2-T8 8 Dual-in-line

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (V_CC) - - - - - - - - - - - - - - - - +22 V dc Logic input voltage (V_IN) - - - - - - - - - - - - - - +7.0 V dc Source/Sink output current (each output): Continuous - - - - - - - - - - - - - - - - - - - - - ±0.5 A Pulse, 500 ns - - - - - - - - - - - - - - - - - - - - ±3.0 A Storage temperature range - - - - - - - - - - - - - - −65°C to +15°C Power dissipation at T_A = +25°C (P_D): Case C - - - - - - - - - - - - - - - - - - - - - - 1.4 W 1/ Case B - - - - - - - - - - - - - - - - - - - - - - 0.6 W 1/ Case P - - - - - - - - - - - - - - - - - - - - - - 1.0 W 1/ Lead temperature (soldering, 10 seconds) - - - - - - +300°C Thermal resistance, junction-to-case (O_JC) - - - - - See MIL-STD-1835 Junction temperature (T_J) - - - - - - - - - - - - - - +150°C

Supply voltage range - - - - - - - - - - - - - - - - 4.5 V dc to 20 V dc 2/ Frequency range - - - - - - - - - - - - - - - - - - - DC to 1.5 MHz Peak pulse current (I_OUT) - - - - - - - - - - - - - ±3.0 A Logic input voltage (V_IN) - - - - - - - - - - - - - −0.5 V dc to 5.5 V dc Ambient operating temperature range (T_A)- - - - - - - −55°C to +125°C

intended Use: