DLA - SMD-5962-88610 REV C
MICROCIRCUIT, MEMORY, DIGITAL, CMOS 2K X 16 DUAL PORT SRAM, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 16 September 1993 |
| Status: | inactive |
| Page Count: | 24 |
scope:
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".
The complete PIN shall be as shown in the following example:
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function Access time 01 (See 6.6) 2K × 16 dual port CMOS SRAM (master) 90 ns 02 (See 6.6) 2K × 16 dual port CMOS SRAM (slave) 90 ns 03 (see 6.6) 2K × 16 dual port CMOS SRAM (master) 70 ns 04 (see 6.6) 2K × 16 dual port CMOS SRAM (slave) 70 ns 05 (see 6.6) 2K × 16 dual port CMOS SRAM (master) 55 ns 06 (see 6.6) 2K × 16 dual port CMOS SRAM (slave) 55 ns 07 (See 6.6) 2K × 16 dual port CMOS SRAM (master) 90 ns 08 (See 6.6) 2K × 16 dual port CMOS SRAM (slave) 90 ns 09 (see 6.6) 2K × 16 dual port CMOS SRAM (master) 70 ns 10 (see 6.6) 2K × 16 dual port CMOS SRAM (slave) 70 ns 11 (see 6.6) 2K × 16 dual port CMOS SRAM (master) 55 ns 12 (see 6.6) 2K × 16 dual port CMOS SRAM (slave) 55 ns
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style U See figure 1 68 flat pack X See figure 1 68 dual-in-line package Y CQCC1-N68 68 square leadless chip carrier Z CMGA3-PN 68 pin grid array
The lead finish shall be as specified in MIL-M-38510. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage range - - - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc DC output current - - - - - - - - - - - - - - - - - 50 mA Storage temperature range - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) - - - - - - - - - - - 2.0 W Lead temperature (soldering, 10 seconds) - - - - - - +260°C Thermal resistance, junction-to-case (ΘJC): Cases U and X - - - - - - - - - - - - - - - - - - 37°C/W Cases Y and Z - - - - - - - - - - - - - - - - - - See MIL-STD-1835 Junction temperature (TJ)- - - - - - - - - - - - - - +150°C 1/
Supply voltage range (VCC) - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc High level input voltage range (VIH) - - - - - - - - 2.2 V dc to 6.0 V dc Low level input voltage range (VIL)- - - - - - - - - −0.5 V dc to +0.8 V dc 2/ Case operating temperature range (TC)- - - - - - - - −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More
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