scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 416160-80 1 MEG-word by 16-bit DRAM, 32 ms refresh 80 ns 02 416160-70 1 MEG-word by 16-bit DRAM, 32 ms refresh 70 ns 03 418160-80 1 MEG-word by 16-bit DRAM, 8 ms refresh 80 ns 04 418160-70 1 MEG-word by 16-bit DRAM, 8 ms refresh 70 ns

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 50 Flat pack

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Voltage range on V_CC . . . . . . . . . . . . . . . . . . −1 V dc to +7 V dc Voltage range on any pin . . . . . . . . . . . . . . . . −1 V dc to +7 V dc Short circuit output current . . . . . . . . . . . . . . +50 mA Maximum power dissipation (P_D) . . . . . . . . . . . . . 1 W Operating free-air temperature range T_A . . . . . . . . . −55°C to +125°C Storage temperature range T_stg . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . +300°C

Thermal resistance, junction-to-case (θ_JC) Case outline X . . . . . . . . . . . . . . . . . . . . 5°C/W 3/ Junction temperature (T_J) 4/ . . . . . . . . . . . . . . +175°C

Supply voltage range (V_CC) . . . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc Supply voltage (V_SS) . . . . . . . . . . . . . . . . . . 0 V dc High-level input voltage (V_IH) . . . . . . . . . . . . . +2.4 V dc minimum to +6.5 V dc maximum Low-level input voltage (V_IL) 5/ . . . . . . . . . . . . −1.0 V dc minimum to +0.8 V dc maximum Transition time (t_T) . . . . . . . . . . . . . . . . . . 3 ns minimum to 30 ns maximum Operating free-air temperature range (T_A) . . . . . . . . −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . 100 percent

intended Use: