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IEC 60749-21

Semiconductor devices Mechanical and climatic test methods Part 21: Solderability

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Organization: IEC
Publication Date: 1 March 2004
Status: inactive
Page Count: 54
ICS Code (Semiconductor devices): 31.080

Document History

April 1, 2011
Semiconductor devices – Mechanical and climatic test methods – Part 21: Solderability
This part of IEC 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or...
IEC 60749-21
March 1, 2004
Semiconductor devices Mechanical and climatic test methods Part 21: Solderability
A description is not available for this item.

References

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