IEC 60749-21
Semiconductor devices Mechanical and climatic test methods Part 21: Solderability
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| Organization: | IEC |
| Publication Date: | 1 March 2004 |
| Status: | inactive |
| Page Count: | 54 |
| ICS Code (Semiconductor devices): | 31.080 |
Document History
April 1, 2011
Semiconductor devices – Mechanical and climatic test methods – Part 21: Solderability
This part of IEC 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or...
IEC 60749-21
March 1, 2004
Semiconductor devices Mechanical and climatic test methods Part 21: Solderability
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