scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 54F00 Quadruple 2-input positive NAND gates

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in line package D GDFP1-F14 or CDFP2-F14 14 Flat package 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC) ----------------------------------------- −0.5 V dc to 7.0 V dc Input voltage ------------------------------------------------------ −1.2 V dc to 7.0 V dc Input current range ------------------------------------------------ −30 mA to 5 mA Voltage range applied to any output in the high state --------------- −0.5 V to V_CC Current into any output in the low state --------------------------- 40 mA Operating free-air temperature range ------------------------------- −55°C to +125°C Maximum power dissipation (P_D)--------------------------------------- 56.1 mW Storage temperature range ------------------------------------------ −65°C to +150°C Thermal resistance, junction-to-case (Θ_JC) ------------------------- See MIL-STD-1835 Junction temperature (T_J) ------------------------------------------ +175°C

Supply voltage range (V_CC) ----------------------------------------- +4.5 V dc to +5.5 V dc Minimum high level input voltage (V_IH) ----------------------------- +2.0 V Maximum low level input voltage (V_IL) ------------------------------ +0.8 V Input clamp current (I_IK) ------------------------------------------ −18mA Maximum high level output current (I_OH) ---------------------------- −1 mA Maximum low level output current (I_OL) ----------------------------- +20 mA Operating free-air temperature range (T_A) -------------------------- −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012)...............................................XX percent 2/

intended Use: