scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes existing of military high reliability (device classes B, Q, and H)and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 EF4442 ARINC 429 multi-channel buffer/receiver 1/

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CDIP2-T28 or GDIP1-T28 28 Dual-in-line

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specification when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) . . . . . . . . . . . . . . . . . . . −0.3 V dc to +7.0 V dc Storage temperature range . . . . . . . . . . . . . . . . . . . −65°C to +150°C Power dissipation (P_D) . . . . . . . . . . . . . . . . . . . . . 600 mW Lead temperature (soldering, 5 seconds) . . . . . . . . . . . . +270°C Thermal resistance, junction-to-case (θ_JC) . . . . . . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (θ_JA) . . . . . . . . . 50°C/W Junction temperature (T_J) . . . . . . . . . . . . . . . . . . . +150°C

Supply voltage range (V_CC) . . . . . . . . . . . . . . . . . . . . . 4.5 V dc to 5.5 V dc High level input voltage, logic inputs (V_IH) . . . . . . . . . . . . 2.0 V dc to V_CC Low level input voltage, logic inputs (V_IL) . . . . . . . . . . . . GND to 0.8 V dc Minimum high level output voltage (V_OH) . . . . . . . . . . . . . . V_CC − 0.75 V dc Maximum low level output voltage (V_OL) . . . . . . . . . . . . . . . 0.5 V dc Frequency of operation (f_OP) . . . . . . . . . . . . . . . . . . . . 2.0 MHz Case operating temperature range (T_C) . . . . . . . . . . . . . . . −55°C to +125°C

intended Use: