scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA Levels and shall be marked with the appropriate RHA designator. Device classes Q and V devices shall meet or exceed the electrical performance characteristics specified in table I herein after exposure to the specified irradiation levels specified in the absolute maximum ratings herein and the RHA marked device shall be marked in accordance with MIL-I-38535. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 LM6125 High speed buffer

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline G A-1 (8-lead, .370" × .185"), can package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (V_S) - - - - - - - - - - - - - - - - - - - - - - ±18 V Input to output voltage 2/ - - - - - - - - - - - - - - - - - - ±7 V Input voltage (V_IN) - - - - - - - - - - - - - - - - - - - - - - ±V_S FLAG output voltage - - - - - - - - - - - - - - - - - - - - - - GND ≤ V_FLAG ≤ +V_S Output short-circuit to GND 3/- - - - - - - - - - - - - - - - - Continuous Storage temperature range - - - - - - - - - - - - - - - - - - - −65°C to +150°C Junction temperature (T_J) - - - - - - - - - - - - - - - - - - - +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - - - - 260°C Power dissipation (P_D) 4/ - - - - - - - - - - - - - - - - - - - 750 mW Thermal resistance, junction-to-case (θ_JC) - - - - - - - - - - See MIL-M-38510, appendix C Thermal resistance, junction-to-ambient (θ_JA) - - - - - - - - - 150°C/W

Supply voltage (V_S) - - - - - - - - - - - - - - - - - - - - ±15 V Ambient operating temperature range (T_A) - - - - - - - - - −55°C to +125°C

intended Use: