DLA - SMD-5962-90825 REV A
MICROCIRCUIT, LINEAR, VOLTAGE REGULATOR, SWITCHING, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 25 August 1993 |
| Status: | inactive |
| Page Count: | 14 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 LT1070 High power switching regulator with internal 5 A switch 02 LT1071 High power switching regulator with internal 2.5 A switch 03 LT1072 High power switching regulator with internal 1.25 A switch 04 LT1070HV High power switching regulator with internal 5 A switch 05 LT1071HV High power switching regulator with internal 2.5 A switch 06 LT1072HV High power switching regulator with internal 1.25 A switch
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style P GDIPI-T8 or CDIP2-T8 8 Dual-in-line Y See figure 1 3 TO-3 flange mount
The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable preference.
Supply voltage (VIN): Device types 01, 02, and 03 . . . . . . . . . . . . . . . . . 40 V Device types 04, 05, and 06 . . . . . . . . . . . . . . . . . 60 V Switch output voltage (VSW): Device types 01, 02, and 03 . . . . . . . . . . . . . . . . . 65 V Device types 04, 05, and 06 . . . . . . . . . . . . . . . . . 75 V Feedback pin voltage (VFB), (transient, 1 ms) . . . . . . . . . ±15 V Junction temperature (TJ) . . . . . . . . . . . . . . . . . . . . +150°C Storage temperature range . . . . . . . . . . . . . . . . . . . . −65°C to 150°C Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . +300°C Thermal resistance, junction-to-case (ΘJC): Case P . . . . . . . . . . . . . . . . . . . . . . . . . . . . See MIL-STD-1835 Case Y: Device types 01 and 04 . . . . . . . . . . . . . . . . . . . 2°C/W Device types 02 and 05 . . . . . . . . . . . . . . . . . . . 4°C/W Device types 03 and 06 . . . . . . . . . . . . . . . . . . . 8°C/W Thermal resistance, junction-to-ambient (ΘJA): Case P . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35°C/W Case Y . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100°C/W
Ambient operating temperature range (TA) . . . . . . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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