scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Memory Operating frequency Circuit function 01 320MC41 128K 40 MHz Digital signal processor multichip module 02 320MC41 128K 50 MHz Digital signal processor multichip module

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-88 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X see figure 1 352 Ceramic Quad Flat Pack

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC) .................................... −0.3 V dc to + 7.0 V dc 2/ Voltage range on any pin (V_IN) ................................. −0.3 V dc to + 7.0 V dc Output voltage range (V_OUT) ................................... −0.3 V dc to + 7.0 V dc Storage temperature range (T_STG) ............................... −65°C to + 150°C Maximum allowed junction temperature(T_J) ...................... 150°C Maximum solder temperature (10s duration) ..................... 260°C Power dissipation (P_D) ........................................ 5.2 W Thermal impedance, Junction-to-case (Θ_JC) ..................... 1.3°C/W

Supply voltage range (V_CC) ..................................... +4.75 V ≤ V_CC ≤ +5.25 V High level input voltage range (V_IH) 3/ CLKIN, COMM .................................................... +2.6 V ≤ V_IH ≤ V_CC + 0.3 V [C bar][S bar][T bar][R bar][B bar][x bar], [C bar][R bar][D bar][Y bar][x bar], [C bar][R bar][E bar][Q bar][x bar], [C bar][A bar][C bar][K bar][x bar] .................................... +2.2 V ≤ V_IH ≤ V_CC + 0.3 V All other pins ................................................ +2.0 V ≤ V_IH ≤ V_CC + 0.3 V Low level input voltage range (V_IL) ............................ −0.3 ≤ V_IL ≤ 0.8 V 3/ High level output current (I_OH) ............................... −300 µA Low level output current (I_OL) ................................. 2 mA Case operating temperature range (T_C) ......................... −55°C to 125°C Maximum operating free-air temperature (T_A) ................... +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ................. XX percent 4/

intended Use: