DLA - SMD-5962-96843
MICROCIRCUIT, LINEAR, VOLTAGE REFERENCE DIODE, 1.2 VOLTS, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 10 April 1996 |
| Status: | inactive |
| Page Count: | 11 |
scope:
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN is as shown in the following example:
Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) identify the circuit function as follows:
Device type Generic number Circuit function 01 LM113 Voltage reference diode 02 LM113-1 Voltage reference diode 03 LM113-2 Voltage reference diode
The device class designator is a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535
The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style X See figure 1 2 TO-46 can
The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.
Reverse current . . . . . . . . . . . . . . . . . . . 50 mA Forward current . . . . . . . . . . . . . . . . . . . 50 mA Storage temperature range (TSTG). . . . . . . . . . . −65°C to 150°C Maximum power dissipation (PD) . . . . . . . . . . . 100 mW 2/ Lead temperature (soldering, 10 seconds,) . . . . . . +300°C Junction temperature . . . . . . . . . . . . . . . . +150°C Thermal resistance, junction-to-case (θJC). . . . . . 80°C/W Thermal resistance, junction-to-ambient (θJA) . . . . 440°C/W
Ambient operating temperature (TA). . . . . . . . . . −55°C to 125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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