This test is designed to determine the peel strength of the metal cladding to the base laminate while exposed to elevated temperature by means of heated air chamber; and to evaluate the base laminate...
This test method is designed to determine the peel strength of metallic cladding when tested in the following conditions, "as received," after thermal stress, and after exposure to processing...
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic...
The purpose of this test is to determine the peel strength of metal cladding to the base laminate while at elevated temperature; and to evaluate the condition of the base laminate material after the...