scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54AS250 1-of-16 data generators/multiplexers with 3-state outputs

The case outline(s) shall be as designated in appendix C of MIL-M-385l0, and as follows:

Outline letter Case outline K F-6 (24-lead, .640" × .420" × .090"), flat package L D-9 (24-lead, 1.280" × .310" × .200"), dual-in-line package 3 C-4 (28-terminal, .460" × .460" × .100"), square chip carrier package

Supply voltage - - - - - - - - - - - - - - - - - - - - +7.0 V dc Input voltage range - - - - - - - - - - - - - - - - - −0.5 V dc minimum to 7.0 V dc maximum Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, l0 seconds) - - - - - - - +300°C Junction temperature (T_J) - - - - - - - - - - - - - - 175°C

Supply voltage range (V_CC) - - - - - - - - - - - - - - +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (V_IH) - - - - - - - - 2.0 V dc Maximum low level input voltage (V_IL)- - - - - - - - - 0.8 V dc High level output current (I_OH)- - - - - - - - - - - - −12 mA Low level output current (I_OL) - - - - - - - - - - - - 32 mA Case operating temperature range (T_C)- - - - - - - - - −55°C to +125°C Thermal resistance, junction to case (θ_JC) - - - - - - See MIL-M-38510, appendix C Maximum power dissipation (P_D) 1/ - - - - - - - - - - 275 mW

intended Use: