scope:

This specification covers the detail requirements for monolithic silicon, low power Schottky TTL, data selector/multiplexer (three-state) logic micro-circuits. Two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the complete part number.

The part number shall be in accordance with MIL-M-38510.

The device type shall be as follows:

Device type Circuit 01 Eight-input data selector/multiplexer, with enable. 02 Dual, four-input data selector/multiplexer, with enable. 03, 04 Quad, two-input data selector/multiplexer, with enable. 05 Eight-input data selector/multiplexer, 3-state outputs, with enable. 06, 07 Quad, two-input data selector/multiplexer, 3-state out- puts with enable. 08 Dual, four-input data selector/multiplexer, 3-state out- puts, with enable. 09 Cascadable, quad, two-input data selector/multiplexer, with storage.

Device class shall be the product assurance level as defined in MIL-M-38510.

The case outline shall be designated as follows:

Outline letter Case outline (see MIL-M-38510, appendix C) 2 C-2 (20-terminal .350" × .350", square chip carrier package) E D-2 (16-lead ¼" × ⅞", dual-in-line package) F F-5 (16-lead ¼" × ⅜" flat package)

Supply voltage range- - - - - - - - - - - - - - - −0.5 V to 7.0 V Input voltage range - - - - - - - - - - - - - - - −1.5 V at −18 mA to 7.0 V Storage temperature range - - - - - - - - - - - - −65°C to 150°C

Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Rome Air Development Center, RBRD, Griffiss AFB, NY 13441, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.

Maximum power dissipation, P_D Device types 01, 02 - - - - - - - - - - - - - 55 mW Device type 03- - - - - - - - - - - - - - - - 88 mW Device type 04- - - - - - - - - - - - - - - - 44 mW Device type 05- - - - - - - - - - - - - - - - 66 mW 1/ Device types 06, 07 - - - - - - - - - - - - - 104.5 mW Device type 08- - - - - - - - - - - - - - - - 77 mW Device type 09- - - - - - - - - - - - - - - - 115.5 mW Lead temperature (soldering, 10 seconds)- - - - 300°C Thermal resistance, junction-to-case (θ_JC) Cases E and F - - - - - - - - - - - - - - - - (See MIL-M-38510, appendix C) Case 2- - - - - - - - - - - - - - - - - - - - 60°C/W 3/ Junction temperature (T_J) 4/ - - - - - - - - - 175°C

Supply voltage (V_CC)- - - - - - - - - - - - - - 4.5 V minimum to 5.5 V maximum Minimum high level input voltage (V_IH)- - - - - 2.0 V Maximum low level input voltage (V_IL) - - - - - 0.7 V Normalized fanout (each output) 2/ Low logic level - - - - - - - - - - - - - - - 10 maximum High logic level- - - - - - - - - - - - - - - 20 maximum Case operating temperature range (T_C) - - - - - −55°C to 125°C Setup time t_(SETUP) type 09 data to clock - - - 15 ns Setup time t_(SETUP) type 09 word select to clock - - - - - - - - - - - - - - - - - - - - 25 ns $ Hold time t_(HOLD) type 09 data to clock - - - - 5 ns Hold time t_(HOLD) type 09 word select to clock - - - - - - - - - - - - - - - - - - - - 0 ns Clock pulse width t_p(CLOCK) type 09 high or low - - - - - - - - - - - - - - - - - - - - - 20 ns

intended Use:

Microcircuits conforming to this specification are intended for original equipment design applications and logistic support, of existing equipment.