scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 1010 1200 gate, field programmable gate array

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CMGA15-PN 84 pin grid array 1/ Y CQCCI-F84 84 unformed-lead chip carrier

The Lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

DC supply voltage range (V_DD)- - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage range (V_I) - - - - - - - - - - - - - - - - −0.5 V dc to V_DD + 0.5 V dc Output voltage range (V_O)- - - - - - - - - - - - - - - - −0.5 V dc to V_DD + 0.5 V dc Input clamp current (I_IC)- - - - - - - - - - - - - - - - ±20 mA Output clamp current (I_OC) - - - - - - - - - - - - - - - ±20 mA Continuous output current I_O)- - - - - - - - - - - - - - ±25 mA Storage temperature range (T_STG) - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - 300°C Thermal resistance, junction-to-case (θ_JC) - - - - - - - See MIL-STD-1835 Maximum junction temperature (T_J) - - - - - - - - - - - +175°C

Supply voltage range (V_DD) - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Case operating temperature range (T_C)- - - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012)- - - - - - XX percent 2/

intended Use: