DOD - SMD 5962-93196
MICROCIRCUIT, DIGITAL, CMOS, LOW SKEW PLL CLOCK DRIVER, MONOLITHIC SILICON
| Organization: | DOD |
| Publication Date: | 3 March 1994 |
| Status: | inactive |
| Page Count: | 20 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Maximum Device type Generic number Circuit function clock frequency 01 88915 Low skew CMOS PLL clock driver 55 MHz
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style Y see figure 1 28 Quad flat pack Z see figure 2 29 Pin grid array
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range (referenced to GND), VCC . . . . . . −0.5 V dc to 6.0 V dc Input voltage range (referenced to GND), VI . . . . . . . −0.5 V dc to VCC + 0.5 V dc Output voltage range (referenced to GND), VO . . . . . . −0.5 V dc to VCC + 0.5 V dc Output current (per pin), IO . . . . . . . . . . . . . . ±50 mA Supply current, VCC or GND . . . . . . . . . . . . . . . ±100 mA Power dissipation, PD . . . . . . . . . . . . . . . . . . 300 mW Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . +300°C Junction temperature, continuous, TJ . . . . . . . . . . +175°C Thermal resistance, junction-to-case, θJC; Case Y . . . . . . . . . . . . . . . . . . . . . . . . 1.50°C/W Case Z . . . . . . . . . . . . . . . . . . . . . . . . 6.74°C/W
Supply voltage range (referenced to GND), VCC . . . . . . 4.5 V dc to 5.5 V dc Input voltage range (referenced to GND), VI . . . . . . . 0 V dc to VCC Output voltage range (referenced to GND), VO . . . . . . 0 V dc to VCC Case operating temperature range, TC . . . . . . . . . . −55°C to +125°C Input rise and fall time range (SYNC input), tr, tf . . . 0 ns to 3.0 ns/V
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . 2/
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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