scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). This drawing describes device requirements for hybrid microcircuits to be processed in accordance with MIL-H-38534. Two product assurance classes, military high reliability (device class H) and space application (device class K) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes H and K RHA marked devices shall meet the MIL-H-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Rating 01 RP-21002D0 28 V dc, solid state power controller 2 Amps 02 RP-21005D0 28 V dc, solid state power control[er 5 Amps 03 RP-21007D0 28 V dc, solid state power controller 7 Amps 04 RP-21010D0 28 V dc, solid state power controller 10 Amps 05 RP-21015D0 28 V dc, solid state power controller 15 Amps 06 RP-21020D0 28 V dc, solid state power controller 20 Amps 07 RP-21025D0 28 V dc, solid state power controller 25 Amps

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation H or K Certification and qualification to MIL-H-38534

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 10 Flange package

The lead finish shall be as specified in MIL-H-38534 for classes H and K. Finish letter shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Power input to power ground ................ 50 V dc continuous (100 V, 50 ms transient) Control input to signal ground ............. V_BIAS + 0.5 V Power ground to signal ground .............. −100 V dc to +100 V dc V_BIAS ...................................... −0.5 V dc to +7.0 V dc Pin to case ................................ −1000 V dc to +1000 V dc Storage temperature range .................. −65°C to +150°C Lead temperature (soldering) ............... +300°C Junction temperature (T_J) .................. +150°C

Power input to power ground ................ +9.0V dc to +40.0 Vdc Control input to signal ground ............. 0 V to V_BIAS Power ground to signal ground .............. −40 V dc to +40 V dc V_BIAS ...................................... +4.5 V dc to +5.5 V dc Case operating temperature range (T_C) ...... −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.