JSA - JIS C 6484
Copper-Clad Laminates for Printed Wiring Boards - Glass Fabric Base, Epoxy Resin
inactive
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| Organization: | JSA |
| Publication Date: | 20 February 1997 |
| Status: | inactive |
| Page Count: | 13 |
Document History
March 20, 2005
Base materials for printed circuits - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test)
A description is not available for this item.
JIS C 6484
February 20, 1997
Copper-Clad Laminates for Printed Wiring Boards - Glass Fabric Base, Epoxy Resin
A description is not available for this item.
January 1, 1991
Copper-Clad Laminates for Printed Wiring Boards - Glass Fabric Base, Epoxy Resin
A description is not available for this item.