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JSA - JIS C 6484

Base materials for printed circuits - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test)

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Organization: JSA
Publication Date: 20 March 2005
Status: active
Page Count: 26
ICS Code (Printed circuits and boards): 31.180

Document History

JIS C 6484
March 20, 2005
Base materials for printed circuits - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test)
A description is not available for this item.
JIS C 6484
February 20, 1997
Copper-Clad Laminates for Printed Wiring Boards - Glass Fabric Base, Epoxy Resin
A description is not available for this item.
JIS C 6484
January 1, 1991
Copper-Clad Laminates for Printed Wiring Boards - Glass Fabric Base, Epoxy Resin
A description is not available for this item.

References

This document is referenced by:
JIS C 62024-1 - High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor
Published by JSA on January 20, 2011
A description is not available for this item.
This document is referenced by:
JIS C 60068-2-21 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
Published by JSA on December 21, 2009
This Standard is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or handling...
This document is referenced by:
JIS C 5201-1 - Fixed resistors for use in electronic equipment-Part 1: Generic specification
Published by JSA on January 20, 2013
This Standard is a generic specification and is applicable to fixed resistors for use in electronic equipment (hereafter referred to as "resistors"). This Standard establishes standard terms,...
This document is referenced by:
JIS C 5260-1 - Potentiometers for use in electronic equipment - Part 1: Generic specification
Published by JSA on September 22, 2014
A description is not available for this item.
This document is referenced by:
JIS C 62137-3 - Electronics Assembly Technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
Published by JSA on September 22, 2014
A description is not available for this item.
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