DOD - SMD 5962-90561
MICROCIRCUIT, DIGITAL, ECL, 8-INPUT PRIORITY DECODER, MONOLITHIC SILICON
| Organization: | DOD |
| Publication Date: | 13 August 1993 |
| Status: | inactive |
| Page Count: | 18 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 10565 8-input priority decoder
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line package F GDFP2-F16 or CDFP3-F16 16 Flat package 2 CQCC1-N20 20 Square chip carrier package
The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked an the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range at VCC = 0 V (VEE) . . . . . . . . . . . −8.0 V dc minimum to 0.0 V dc maximum Input voltage range (VIN) . . . . . . . . . . . . . . . . . . 0 V dc to VEE Output source current, continuous (IO) . . . . . . . . . . . . 50 mA Storage temperature range . . . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature soldering, 10 seconds). . . . . . . . . . . . +300°C Junction temperature (TJ) . . . . . . . . . . . . . . . . . . +165°C Maximum power dissipation (PD) . . . . . . . . . . . . . . . . 750 mW Thermal resistance, junction-to-case (ΘJC) . . . . . . . . . . See MIL-STD-1835
Supply voltage range at VCC = 0 V (VEE) . . . . . . . . . . . −5.46 V dc minimum to −4.94 V dc maximum Ambient operating temperature range (TA) . . . . . . . . . . . −55°C to +125°C Minimum high level input voltage (VIH): TA = +25°C . . . . . . . . . . . . . . . . . . . . . . . . . −0.780 V dc TA = +125°C . . . . . . . . . . . . . . . . . . . . . . . . −0.630 V dc TA = −55°C . . . . . . . . . . . . . . . . . . . . . . . . . −0.880 V dc Maximum low level input voltage (VIL): TA = +25°C . . . . . . . . . . . . . . . . . . . . . . . . . −1.850 V dc TA = +125°C . . . . . . . . . . . . . . . . . . . . . . . . −1.820 V dc TA = −55°C . . . . . . . . . . . . . . . . . . . . . . . . . −1.920 V dc
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . 2/ percent
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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