scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q, and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54F803 clock driver quad D-type flip-flops

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 dual-in-line package D GDFP1-F14 or CDFP2-F14 14 flat package 2 CQCC1-N20 20 square chip carrier package

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC)- - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage range (V_IN) - - - - - - - - - - - - - - - - −1.2 V dc at −18 mA to +7.0 V dc Storage temperature range - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - +300°C Junction temperature (T_J) - - - - - - - - - - - - - - - - +175°C Maximum power dissipation (P_D): 2/- - - - - - - - - - - - 385 mW Thermal resistance, junction-to-case (Θ_JC) - - - - - - - See MIL-STD-1835

Supply voltage range (V_CC)- - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Maximum input clamp current, (I_IK)- - - - - - - - - - - - −1.2 mA Maximum high level output current, (I_OH)- - - - - - - - - −1 µA Maximum low level output current, (I_OL) - - - - - - - - - 20 mA Input rise and fall times, (t_r, t_f) - - - - - - - - - - - 2.5 ns Maximum feedback time, tf (tf = t_p + t_s)- - - - - - - - - 11.5 max ns High level input voltage, (V_IH) - - - - - - - - - - - - - 2.0 V Low level input voltage, (V_IL) - - - - - - - - - - - - - 0.8 V Case operating temperature range (T_C) - - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - - - - - - 3/ percent

intended Use: