DLA - SMD-5962-96806
MICROCIRCUIT, DIGITAL, ADVANCED HIGH SPEED CMOS, OCTAL BUFFER/DRIVER WITH INVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 18 April 1996 |
| Status: | inactive |
| Page Count: | 16 |
scope:
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN is as shown in the following example:
Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) identify the circuit function as follows:
Device type Generic number Circuit function 01 54AHCT240 Octal buffer/driver with inverting three-state outputs, TTL compatible inputs
The device class designator is a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535
The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier
The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.
Supply voltage range (VCC) . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc DC input voltage range (VIN) . . . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT) . . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc 4/ DC input clamp current (IIK) (VIN < 0.0 or VIN > VCC) . . . . . . . . . . −20 mA DC output clamp current (IOK) (VOUT < 0.0 or VOUT > VCC) . . . . . . . . . −20 mA Continuous output current (IOL) (VO = 0 to VCC) . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . ±75 mA Storage temperature range (TSTG) . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . . +300°C Thermal resistance, junction-to-case (ΘJC) . . . . . . . . . . . . . . . See MIL-STD-1835 Junction temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . +175°C Maximum power dissipation at TA = +55°C (in still air) (PD) . . . . . . . 500 mW
Supply voltage range (VCC) . . . . . . . . . . . . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc Minimum high level input voltage (VIH) . . . . . . . . . . . . . . . . . . +2.0 V Maximum low level input voltage (VIL) . . . . . . . . . . . . . . . . . . +0.8 V Input voltage range (VIN) . . . . . . . . . . . . . . . . . . . . . . . . +0.0 V dc to VCC Output voltage range (VOUT) . . . . . . . . . . . . . . . . . . . . . . . +0.0 V dc to VCC Maximum high level output current (IOH) . . . . . . . . . . . . . . . . . −8 mA Maximum low level output current (IOL) . . . . . . . . . . . . . . . . . . +8 mA Maximum input rise or fall rate (Δt/ΔV) . . . . . . . . . . . . . . . . . +20 ns/V Case operating temperature range (TC) . . . . . . . . . . . . . . . . . . −55°C to +125°C
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . . . . XX percent 5/
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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