IPC - TM-650 2.4.28.1A
Adhesion, Solder Mask (Tape Test Method)
inactive
| Organization: | IPC |
| Publication Date: | 1 February 1988 |
| Status: | inactive |
| Page Count: | 1 |
Document History
March 1, 2007
Solder Mask Adhesion - Tape Test Method
This test method defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated and reflowed solder printed boards both prior to and...
May 1, 2004
Adhesion, Solder Resist (Mask), Tape Test Method
This test method defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated and reflowed solder printed boards both prior to and...
March 1, 1998
Adhesion, Solder Resist (Mask), Tape Test Method
A description is not available for this item.
August 1, 1997
Adhesion, Solder Resist (Mask), Tape Test Method
A description is not available for this item.
TM-650 2.4.28.1A
February 1, 1988
Adhesion, Solder Mask (Tape Test Method)
A description is not available for this item.