scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) Levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 OP-27 Low noise precision operational amplifier

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage ±V_S . . . . . . . . . . . . . . . . . . ±22 V Input voltage (V_IN) . . . . . . . . . . . . . . . . . ±22 V Internal power dissipation (P_D). . . . . . . . . . . . 500 mW Output short circuit duration. . . . . . . . . . . . . Indefinte Differential input voltage (V_IND). . . . . . . . . . . ±0.7 V Differential input current (I_IND) . . . . . . . . . . ±25 mA Storage temperature range . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 60 seconds) . . . . . . . +300°C Dice junction temperature (T_J) . . . . . . . . . . . . −65°C to +150°C Thermal resistance, junction-to-case (Θ_JC) . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (Θ_JA) . . . . . 110°_C/W

Supply voltage (±V_S) ............................ ±15 V Operating ambient temperature range (T_A ) ....... −55°C to +125'c

intended Use: