scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following examples.

For device classes M and Q:

For device class V:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 LM139A Quad voltage comparator

The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device.

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack X See figure 1 14 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range ...........................36 V dc or ±18 V dc Input voltage range ............................−0.3 V dc to 36 Vdc Input current (V_IN < −0.3 V)....................50 mA Maximum power dissipation (P_D) .................900 mW 2/ Sink current ...................................20 mA approximately Lead temperature (soldering 10 seconds) ........300°C Storage temperature ............................−65°C to +150°C Junction temperature (T_J).......................150°C Thermal resistance, junction-to-case (Θ_JC): Cases C, D, and 2 ............................See MIL-STD-1835 Case X .......................................23°C/W

Supply voltage ............................... 5 V dc to 30 V dc Ambient operating temperature range (T_A) .......−55°C to +125°C

intended Use: