scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Minimum Propagation delay, Device type Generic number Circuit function operating period HCLK to DOUTENA 01 RH-1750 Microprocessor, multichip module (MCM) 40 ns max 8.0 ns to 33 ns 02 RH-1750 Microprocessor, multichip module (MCM) 55 ns max 8.0 ns to 33 ns 03 RH-1750 Microprocessor, multichip module (MCM) 55 ns max 8.0 ns to 36 ns 04 RH-1750 Microprocessor, multichip module (MCM) 50 ns max 8.0 ns to 33 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style Y see figure 1 200 Quad flat package

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_DD) . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc DC input voltage range (V_IN) . . . . . . . . . . . . . . −0.5 V dc to V_DD + 0.5 V dc DC output voltage range (V_OUT) . . . . . . . . . . . . . −0.5 V dc to V_DD + 0.5 V dc DC input current (I_IN) 3/ . . . . . . . . . . . . . . . . ±50 mA DC output current (I_OUT) 4/ . . . . . . . . . . . . . . . ±50 mA Output voltage applied in high impedance state . . . . . −0.5 V dc to V_DD + 0.5 V dc Power dissipation (P_D) . . . . . . . . . . . . . . . . . 4.87 W (peak) Lead temperature (soldering, 5 seconds) . . . . . . . . . +270°C Maximum junction temperature (T_J) . . . . . . . . . . . . 150°C Thermal resistance. junction-to-case (θ_JC) . . . . . . . 1.0°C/W Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C

Supply voltage range (V_DD) . . . . . . . . . . . . . . . 4.5 V dc to 5.0 V dc DC input voltage range (V_IN) . . . . . . . . . . . . . . −0.3 V dc to V_DD + 0.3 V dc DC output voltage range (V_OUT) . . . . . . . . . . . . . −0.3 V dc to V_DD + 0.3 V dc DC input current (I_IN) 3/ . . . . . . . . . . . . . . . . ±10 mA DC output current (I_OUT) 4/ . . . . . . . . . . . . . . . ±12 mA Capacitive output load (C_L) 5/ . . . . . . . . . . . . . 50 pF Case operating temperature range (T_C) . . . . . . . . . . −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . 98.4 percent

intended Use: