scope:

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL- PRF-38535, appendix A.

The complete PIN is as shown in the following example:

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 10H576 Hex D-type master slave flip-flop

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat package X CDFP4-F16 16 Flat package 2 CQCC1-N20 20 Square chip carrier

The lead finish is as specified in MIL-PRF-38535, appendix A.

Supply voltage range (V_EE)...................... −8.0 V dc to 0.0 V dc Input voltage range............................. −5.2 V dc to 0.0 V dc Storage temperature range....................... −65°C to +165°C Lead temperature (soldering, 10 seconds)........ +300°C Junction temperature (T_J)....................... +165°C Maximum power dissipation (P_D).................. 717 mW Thermal resistance, junction-to-case (Θ_JC)...... See MIL-STD-1835

Supply voltage range (V_EE)...................... −5.46 V dc minimum to −4.94 V dc maximum Ambient operating temperature range (T_A)........ −55°C to +125°C Minimum high level input voltage (V_IH): T_A = +25°C................................... −0.780 V T_A = +125°C.................................. −0.650 V T_A = −55°C................................... −0.840 V Maximum low level input voltage (V_IL)........... −1.950 V Minimum setup time(t_s).......................... 1.5 ns Minimum hold time (t_h).......................... 0.80 ns

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.