scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 29FCT52A/54FCT52A Octal registered transceiver with three-state outputs 02 29FCT52B/54FCT52B Octal registered transceiver with three-state outputs 03 29FCT52C/54FCT52C Octal registered transceiver with three-state outputs

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package type K GDFP2-F24 or CDFP3-F24 24 flat pack L GDIP3-T24 or CDIP4-T24 24 dual-in-line 3 CQCC1-N28 28 leadless chip carrier

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Terminal voltage range (V_TERM) (referenced to ground): Inputs and V_CC terminals . . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc Outputs and I/O terminals . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to V_CC Storage temperature range (T_STG) . . . . . . . . . . . . . . . . . . −65°C to +150°C Bias temperature range (T_BIAS) . . . . . . . . . . . . . . . . . . . −65°C to +135°C DC output current (I_OUT) . . . . . . . . . . . . . . . . . . . . . . 120 mA Power dissipation (P_D) . . . . . . . . . . . . . . . . . . . . . . . 500 mW Junction temperature . . . . . . . . . . . . . . . . . . . . . . . . +175°C Thermal resistance (Θ_JC) . . . . . . . . . . . . . . . . . . . . . . See MIL-STD-1835 Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . +275°C

Supply voltage range (V_CC) . . . . . . . . . . . . . . . . . . . . . 4.5 V dc to 5.5 V dc High-level input voltage (V_IH) . . . . . . . . . . . . . . . . . . . 2.0 V dc minimum Low-level input voltage (V_IL) . . . . . . . . . . . . . . . . . . . 0.8 V dc maximum Case operating temperature range (T_C) . . . . . . . . . . . . . . . −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . XX percent 2/

intended Use: