DLA - SMD-5962-94514
MICROCIRCUIT, LINEAR, MICROPROCESSOR SUPERVISORY CIRCUIT, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 18 January 1994 |
| Status: | inactive |
| Page Count: | 15 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 MAX1232 Microprocessor supervisory circuit
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage to ground (VCC to GND) . . . . . . . . . −0.3 V to +6.0 V Maximum current at any terminal . . . . . . . . . . . . 10 mA Input voltage [S bar][T bar], TOL, [P bar][B bar][ bar][R bar][S bar][T bar], TD . . . . . . . . . . . −0.3 V to (VCC+0.3 V) Power dissipation (PD) at TA = +70°C: Case P. . . . . . . . . . . . . . . . . . . . . . . . 640 mW 2/ Case 2. . . . . . . . . . . . . . . . . . . . . . . . 727 mW 2/ Lead temperature (soldering, 10 seconds). . . . . . . . +300°C Storage temperature range . . . . . . . . . . . . . . . −65°C to +160°C Thermal resistance, junction-to-case (ΘJC) . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (ΘJA): Case P. . . . . . . . . . . . . . . . . . . . . . . . +125°C/W Case 2. . . . . . . . . . . . . . . . . . . . . . . . +110°C/W
Supply voltage range . . . . . . . . . . . . . . . . . +4.5 V to +5.5 V Ambient operating temperature range (TA) . . . . . . . −55°C to +125°C Input capacitance (CIN) at [S bar][T bar] and TOL pins . . . . . . 5 pF Output capacitance (COUT) at RST and [R bar][S bar][T bar] pins . . . . . 7 pF
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
Microcircuits... View More
Document History
