scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 54AHC08 Quadruple 2-input positive-AND gate

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-Tl4 14 Dual-in-line D GDFP1-Fl4 or CDFP2-Fl4 14 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC)...................................... −0.5 V dc to +7.0 V dc DC input voltage range (V_IN) ................................... −0.5 V dc to +7.0 V dc 4/ DC output voltage range (V_OUT) ................................. −0.5 V dc to V_CC +0.5 V dc 4/ DC input clamp current (I_IK) (V_IN < 0.0)........................ −20 mA DC output clamp current (I_OK) (V_OUT < 0.0 or V_OUT > V_CC) ....... ±20 mA Continuous output current (I_O) (V_O = 0 to V_CC) ................. ±20 mA Continuous current through V_CC or GND .......................... ±50 mA Storage temperature range (T_STG) ............................... −65°C to +150°C Lead temperature (soldering, 10 seconds)........................ +300°C Thermal resistance, junction-to-case (Θ_JC)...................... See MIL-STD-1835 Junction temperature (T_J) ..................................... +150°C Maximum power dissipation at T_A = +55°C (in still air) (P_D) .... 500 mW

Supply voltage range (V_CC)..................................... +2.0 V dc to +5.5 V dc Input voltage range (V_IN) ..................................... +0 V dc to V_CC Output voltage range (V_OUT).................................... +0.0 V dc to V_CC Minimum high level input voltage (V_IH): V_CC = 2.0 V .................................................. +1.5 V V_CC = 3.0 V .................................................. +2.1 V V_CC = 5.0 V ± 0.5 V .......................................... +3.85 V Maximum low level input voltage (V_IL): V_CC = 2.0 V .................................................. +0.5 V V_CC = 3.0 V .................................................. +0.9 V V_CC = 5.0 V ± 0.5 V .......................................... +1.65 V Maximum high level output current (I_OH): V_CC = 2.0 .................................................... −50 µA V_CC = 3.3 V ± 0.3 V .......................................... −4 mA V_CC = 5.0 V ± 0.5 V .......................................... −8 mA Maximum low level output current (I_OL): V_CC = 2.0 V .................................................. +50 µA V_CC = 3.3 V ± 0.3 V .......................................... +4 mA V_CC = 5.0 V ± 0.5 V .......................................... +8 mA Maximum input rise or fall rate (Δt/ΔV): V_CC = 3.3 V ± 0.3 V .......................................... 100 ns/V V_CC = 5.0 V ± 0.5 V .......................................... 20 ns/V Case operating temperature range (T_C) ......................... −55°C to + 125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) .................. XX percent 6/

intended Use: