scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Skew error 01 7B992 Programmable skew clock buffer 0.7 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CQCC1-N32 32 Leadless chip carrier

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CCN, V_CCQ) - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC input voltage range (V_IN)- - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Output current into outputs (Low) (I_OL) - - - - - - - - - - 64 mA Storage temperature range (T_STG)- - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D)- - - - - - - - - - - - - - - 911 mW Lead temperature (soldering, 10 seconds)- - - - - - - - - - +260°C Thermal resistance, junction-to-case (Θ_JC)- - - - - - - - - See MIL-STD-1835 Junction temperature (T_J) - - - - - - - - - - - - - - - - - +175°C

Supply voltage range (V_CCN, V_CCQ) - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Input voltage range (V_IN) - - - - - - - - - - - - - - - - - 0.0 V dc to V_CCQ Output voltage range (V_OUT) - - - - - - - - - - - - - - - - 0.0 V dc to V_CCN High Level input voltage range (V_IH, V_IHH): V_IH - - - - - - - - - - - - - - - - - - - - - - - - - - - V_CCQ − 1.35 V dc to V_CCQ 4/ V_IHH- - - - - - - - - - - - - - - - - - - - - - - - - - - V_CCQ − 1.00 V dc to V_CCQ 5/ 6/ Mid level input voltage range (V_IMM) - - - - - - - - - - - V_CCQ/2 ±500 mV dc 5/ Low level input voltage range (V_IL, V_ILL): V_IL - - - - - - - - - - - - - - - - - - - - - - - - - - - −0.0 V dc to 1.35 V dc 4/ V_ILL- - - - - - - - - - - - - - - - - - - - - - - - - - - 0.0 V dc to 1.0 V dc 5/ 6/ Case operating temperature (T_C) - - - - - - - - - - - - - - −55°C to +125°C Input rise or fall time (t_r, t_f): (0.2V_CC to 0.8V_CC: 0.8V_CC to 0.2V_CC)- - - - - - - - - - - 0 to 3 ns Maximum high level output current (I_OH) - - - - - - - - - - −40 mA Maximum low level output current (I_OL)- - - - - - - - - - - +46 mA

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - XX percent 7/

intended Use: