scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q ard M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA Levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 49FCT805BT Buffer/clock driver with noninverting three-state outputs, TTL compatible inputs and limited output voltage swing 02 49FCT805CT Buffer/clock driver with noninverting three-state outputs, TTL compatible inputs and limited output voltage swing

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835, and as follows:

Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat package 2 CQCC1-N20 20 Leadless chip carrier

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) . . . . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc DC input voltage range (V_IN) . . . . . . . . . . . . . . . . . −0.5 V dc to V_CC + 0.5 V dc 4/ DC output voltage range (V_OUT) . . . . . . . . . . . . . . . . −0.5 V dc to V_CC + 0.5 V dc 4/ DC input clamp current (I_IK) (V_IN = −0.5 V ) . . . . . . . . . −20 mA DC output clamp current (I_OK) (V_OUT = −0.5 V and +7.0 V) . . . ±20 mA DC output source current (I_OH) (per output) . . . . . . . . . −30 mA DC output sink current (I_OL) (per output) . . . . . . . . . . +70 mA DC V_CC current (I_CC) . . . . . . . . . . . . . . . . . . . . . ±260 mA Ground current (I_GND) . . . . . . . . . . . . . . . . . . . . +550 mA Storage temperature range (T_STG) . . . . . . . . . . . . . . . −65°C to +150°C Case temperature under bias, (T_BIAS) . . . . . . . . . . . . . −65°C to +135°C Lead temperature (soldering 10 seconds) . . . . . . . . . . . +300°C Thermal resistance, junction-to-case (Θ_JC) . . . . . . . . . . See MIL-STD-1835 Junction temperature (T_J) . . . . . . . . . . . . . . . . . . +175°C Maximum power dissipation (P_D) . . . . . . . . . . . . . . . . 500 mW

Supply voltage range (V_CC) . . . . . . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc Input voltage range (V_IN) . . . . . . . . . . . . . . . . . . +0.0 V dc to V_CC Output voltage range (V_OUT).. . . . . . . . . . . . . . . . . . +0.0 V dc to V_CC Maximum low level input voltage (V_IL) . . . . . . . . . . . . 0.8 V Minimum high level input voltage ((V_IH) . . . . . . . . . . . . 2.0 V Case operating temperature range (T_C) . . . . . . . . . . . . . −55°C to +125°C Maximum input rise or fall rate (Δt/ΔV): (from V_IN = 0.3 V to 2.7 V, 2.7 V to 0.3 V) . . . . . . . . 5.0 ns/V Maximum high level output current (I_OH) . . . . . . . . . . . −24 mA Maximum low level output current (I_OL) . . . . . . . . . . . . 32 mA

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . XX percent 5/

intended Use: