scope:

This specification covers the detail requirements for monolithic silicon, TTL, microcircuit decoders. Qualification inspection requirements are removed for device types 02, 03, and 09. These device types are inactive for new design after the date of this revision. For the remaining device types 01, 04, 05, 06, 07, and 08, two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the complete part number.

The part number shall be in accordance with MIL-M-38510, with the exception that the "JAN" or "J" certification mark shall not be used for devices 02, 03, and 09.

The device type shall be as shown in the following:

Device type Circuit 01 BCD-to-decimal decoder 02 1/ Excess-3-to-decimal decoder 03 1/ Excess-3-gray-to-decimal decoder 04 BCD-to-decimal decoder/driver (30-volt, open collector output) 05 BCD-to-decimal decoder/driver (15-volt, open collector output) 06 BCD-to-seven-segment decoder/driver (30-volt, open collector output) 07 BCD-to-seven-segment decoder/driver (15-volt, open collector output) 08 BCD-to-seven-segment decoder/driver 09 1/ BCD-to-seven-segment decoder/driver (5.5-volt, open collector output)

The device class shall be the product assurance level as defined in MIL-M-38510.

The case outline shall be designated as follows:

Letter Case outline (see MIL-M-38510, appendix C) A F-1 (14-pin, ¼" × ¼"), flat-package B F-3 (14-pin, 3/16" × ¼"), flat-package C D-1 (14-pin, ¼" × ¾"), dual-in-line package D F-2 (14-pin, ¼" × ⅜"), flat-package E D-2 (16-pin, ¼" × ⅞"), dual-in-line package F F-5 (16-pin, ¼" × ⅜"), flat-package

Supply voltage range- - - - - - - - - - - - - −0.5 to 7.0 V dc Input voltage range - - - - - - - - - - - - - −1.5 V dc at −12 mA to 5.5 V dc Storage temperature range - - - - - - - - - - −65°C to 150°C

Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Rome Air Development Center (RBE-2), Griffiss AFB, NY 13441, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.

Maximum power dissipation, (P_D) 2/- - - - - - 226 mW dc (device types 01, 02 and 03) 3/ 341 mW dc (device types 04 and 05 467 mW dc (device types 06, 07, 08 and 09) 3/ Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - - 300°C Thermal resistance, junction to case (θ_JC): Cases A, B, C, D, E, F- - - - - - - - - - - - - - (See MIL-M-38510, appendix C) Junction temperature (T_J) 4/- - - - - - - - - - - - +175°C Maximum current into any output (output off): Device types 04, 05, 06, 07 and 09 3/ - - - - - - 1 mA

Supply voltage (V_CC)- - - - - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (V_IH)- - - - - - - 2.0 V dc Maximum low level input voltage (V_IL) - - - - - - - 0.8 V dc Sink-current capability by device type: 01, 02, 03 3/ - - - - - - - - - - - - - - - - - - 16 mA 04, 05- - - - - - - - - - - - - - - - - - - - - - - 20 mA 06, 07 outputs a-g. - - - - - - - - - - - - - - - 40 mA BI/RBO node - - - - - - - - - - - - - - - - 8 mA 08 outputs a-g. - - - - - - - - - - - - - - - 6.4 mA BI/RDO node - - - - - - - - - - - - - - - - 8mA 09 3/ - - - - - - - - - - - - - - - - - - - - - - 10 mA Case operating temperature range (T_C) - - - - - - - - −55°C to +125°C

intended Use: