scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) Levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA Levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54HCT137 3-to-8 line decoder/demultiplexor with address latches, TTL compatible inputs

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline Letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier

The Lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc DC input voltage range (V_IN) . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to V_CC + 0.5 V dc DC output voltage range (V_OUT) . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to V_CC + 0.5 V dc DC input clamp current (I_IK) (V_I < 0 V, V_I > V_CC) . . . . . . . . . . . . . . ±20 mA DC output clamp current (I_OK) (V_O < 0 V, V_O > V_CC) . . . . . . . . . . . . . . ±20 mA DC output current, per output (I_OUT) (V_OUT = 0 to V_CC) (per output) . . . . . ±25 mA DC V_CC or ground current (I_CC or I_GND) (per pin) . . . . . . . . . . . . . . . ±50 mA Maximum power dissipation (P_D) . . . . . . . . . . . . . . . . . . . . . . . . 500 mw 4/ Storage temperature range (T_STG) . . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . +300°C Thermal resistance, junction-to-case (Θ_JC) . . . . . . . . . . . . . . . . . . See MIL-STD-1835 Junction temperature (T_J) . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C Case operating temperature range (T_C) . . . . . . . . . . . . . . . . . . . . −55°C to +125°C

Supply voltage range (V_CC) . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5 V dc to 5.5 V dc Input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.0 V dc to V_CC Output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.0 V dc to V_CC Case operating temperature range (T_C) . . . . . . . . . . . . . . . . . . . . −55°C to +125°C Maximum low level input voltage (V_IL) . . . . . . . . . . . . . . . . . . . . 0.8 V dc Minimum high level input voltage (V_IH) . . . . . . . . . . . . . . . . . . . . 2.0 V dc Input rise and fall times range (t_r, t_f) (0.1 to 0.9V_IN, 0.9 to 0.1V_IN) . . . 0 to 500 ns Maximum high level output current (I_OH) . . . . . . . . . . . . . . . . . . . −4 mA Maximum low level output current (I_OL) . . . . . . . . . . . . . . . . . . . . +4 mA

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . . . . . . 5/ percent

intended Use: