scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 AD7890-10 8-Channel, 12-Bit Serial, Data Acquisition System

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.4 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 Dual-in-line

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

V_DD to AGND - - - - - - - - - - - - - - - - - - - - - - - −0.3 V dc to +7 V dc V_DD to DGND - - - - - - - - - - - - - - - - - - - - - - - −0.3 V dc to +7 V dc Analog input voltage to AGND - - - - - - - - - - - - - - ±17 V dc Reference input voltage to AGND - - - - - - - - - - - - - −0.3 V dc to V_DD + 0.3 V dc Digital input voltage to DGND - - - - - - - - - - - - - - −0.3 V dc to V_DD + 0.3 V dc Digital output voltage to DGND - - - - - - - - - - - - - −0.3 V dc to V_DD + 0.3 V dc Junction temperature (T_J) - - - - - - - - - - - - - - - - +150°C Power dissipation (P_D) - - - - - - - - - - - - - - - - - 450 mW Thermal resistance, junction-to-ambient (θ_JA) - - - - - - 70°C/W Thermal resistance, junction-to-case (θ_JC) - - - - - - - See MIL-STD-1835 Lead temperature (soldering, 10 secs) - - - - - - - - - - +300°C

Ambient operating temperature range - - - - - - - - - - - 55°C to +125°C

intended Use: