scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 MAX690 Microprocessor watchdog/battery switchover/reset generator 02 MAX692 Microprocessor watchdog/battery switchover/reset generator 03 MAX694 Microprocessor watchdog/battery switchover/reset generator

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 dual-in-line H GDFP1-F10 or CDFP2-F10 10 flat package X CDFP3-F10 10 flat package 2 CQCC1-N20 20 square leadless chip carrier

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) - - - - - - - - - - - - −0.3 V dc to +6.0 V dc Battery voltage range (V_BATT) - - - - - - - - - - −0.3 V dc to +6.0 V dc All other inputs - - - - - - - - - - - - - - - - - −0.3 V dc to (V_OUT + 0.5 V) Input current V_CC - - - - - - - - - - - - - - - - - - - - - - +200 mA V_BATT - - - - - - - - - - - - - - - - - - - - - +50 mA GND - - - - - - - - - - - - - - - - - - - - - - +20 mA Output current V_OUT - - - - - - - - - - - - - - - - - - - - - - Short circuit protected All other outputs - - - - - - - - - - - - - - - +20 mA Rate-of-rise, V_BATT, V_CC - - - - - - - - - - - - - +100 V/µs Storage temperature range - - - - - - - - - - - - −65°C to +160°C Continuous total power dissipation (P_D) (T_A = +70°C) 2/: H and X package - - - - - - - - - - - - - - - - 421 mW P package - - - - - - - - - - - - - - - - - - - 640 mW 2 package - - - - - - - - - - - - - - - - - - - 727 mW Lead temperature (soldering, 10 seconds) - - - - - - +300°C Thermal resistance, junction-to-case (θ_JC) - - - - - See MIL-STD-1835 Thermal resistance, junction-to-ambient (θ_JA): H and X package - - - - - - - - - - - - - - - - - 190°C/W P package - - - - - - - - - - - - - - - - - - - - 125°C/W 2 package - - - - - - - - - - - - - - - - - - - - 110°C/W

Supply voltage (V_CC): Device types 01 and 03 - - - - - - - - - - - - - 4.75 V dc to 5.5 V dc Device type 02 - - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Battery voltage (V_BATT) - - - - - - - - - - - - - 2.8 V Ambient operating temperature range (T_A) - - - - - −55°C to +125°C

intended Use: