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DIN EN 60749-27

Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006); German version EN 60749-27:2006

inactive
Organization: DIN
Publication Date: 1 January 2007
Status: inactive
Page Count: 15
ICS Code (Plug-and-socket devices. Connectors): 31.220.10

Document History

April 1, 2013
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006 + A1:2012); German version EN 60749-27:2006 + A1:2012
In diesem Teil der IEC 60749 ist ein Standardverfahren festgelegt, um Halbleiterbauelemente hinsichtlich deren Empfindlichkeit auf Beschädigungen oder Degradationen (Leistungsminderungen) zu prüfen...
October 1, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 47/2107/CDV:2011); German version EN 60749-27:2006/FprA1:2011
A description is not available for this item.
DIN EN 60749-27
January 1, 2007
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006); German version EN 60749-27:2006
A description is not available for this item.
May 1, 2005
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 47/1804/CDV:2005); German version prEN 60749-27:2005
A description is not available for this item.
September 1, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing; Machine model (MM) (IEC 47/1624/CDV:2002); German version prEN 60749-27:2002
A description is not available for this item.
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