DLA - SMD-5962-94676 REV B
MICROCIRCUIT, LINEAR, CURRENT FEEDBACK AMPLIFIER, ULTRA HIGH SPEED, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 31 January 1996 |
| Status: | inactive |
| Page Count: | 17 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 HFA1100 Ultra high speed current feedback amplifier 02 HS1100RH Radiation hardened, ultra high speed current feedback amplifier
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line package
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Voltage between +VS and −VS . . . . . . . . . . . . . . . . . . 12 V dc Differential input voltage . . . . . . . . . . . . . . . . . . 5 V dc Voltage at either input terminal . . . . . . . . . . . . . . . +VS and −VS Output current (50% duty cycle) . . . . . . . . . . . . . . . . ±55 mA Maximum package power dissipation (PD) (TA = +125°C) . . . . . 0.45 W 2/ Junction temperature (TJ) . . . . . . . . . . . .. . . . . . . +175°C Storage temperature range (TSTG) . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . . . . +300°C Thermal resistance, junction-to-case (ΘJC) . . . . . . . . . . 27°C/W Thermal resistance, junction-to-ambient (ΘJA) . . . . . . . . . 112°C/W
Operating supply voltage (±VS) . . . . . . . . . . . . . . . . ±5 V Load resistance (RL) . . . . . . . . . . . . . . . . . . . . . ≥ 50 Ω Ambient operating temperature range (TA) . . . . . . . . . . . −55°C to +125°C Radiation features (device type 02 only): Neutron . . . . . . . . . . . . . . . . . . . . . . . . . . 3/ Total dose . . . . . . . . . . . . . . . . . . . . . . . . . > 300 Krads 4/ Latch up . . . . . . . . . . . . . . . . . . . . . . . . . . None 5/
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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