scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Devices classes Q and V RHA marked devices meet the MIL-PRF-35835 specified RHA levels and are marked with the appropriate RHA designator. Device classes M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 54ABT245 Octal Bus transceiver with 3-state outputs TTL compatible inputs 02 54ABT245A Octal Bus transceiver with 3-state outputs TTL compatible inputs

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 complaint, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC)......................................... −0.5 V dc to +7.0 V dc DC input voltage range except I/O ports (V_IN)...................... −0.5 V dc to +7.0 V dc 4/ DC output voltage range (V_OUT)..................................... −0.5 V dc to +5.5 V dc 4/ DC input clamp current (I_IK)....................................... −18 mA DC output clamp current(I_OK)....................................... −50 mA DC output current (I_OL)(per output)................................ +96 mA Storage temperature range (T_STG)................................... −65°c to +150°C Lead temperature (soldering, 10 seconds)........................... +300°C Thermal resistance, junction-to-case (Θ_JC)......................... See MIL-STD-1835 Junction temperature (T_J).......................................... +175°C Maximum power dissipation (P_D)..................................... 500 mW

Supply voltage range (V_CC) (Operating)............................. +4.5 V dc to +5.5 V dc Input voltage range (V_IN).......................................... +0.0 V dc to V_CC Output voltage range (V_OUT)........................................ +0.0 V dc to V_CC Maximum low level input voltage (V_IL).............................. 0.8 V Maximum high level input voltage (V_IH)............................. 2.0 V Case operating temperature range (T_C).............................. −55°C to +125°C Maximum input rise and fall rate (Δt/ΔV)........................... 5 ns/V Maximum high level output current (I_OH)............................ −24 mA Maximum low level output current (I_OL)............................. 48 mA

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012)...................... XX percent 5/

intended Use: