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IPC-SC-60

Post Solder Solvent Cleaning Handbook

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Organization: IPC
Publication Date: 1 August 1999
Status: inactive
Page Count: 48
scope:

This handbook addresses solvent cleaning of electrical/ electronic assemblies, parts and application tools after soldering.

Document History

IPC-SC-60
August 1, 1999
Post Solder Solvent Cleaning Handbook
This handbook addresses solvent cleaning of electrical/ electronic assemblies, parts and application tools after soldering.
SC-60
April 1, 1987
Post Solder Solvent Cleaning Handbook
A description is not available for this item.

References

This document references:
29 CFR PART 1910 - OCCUPATIONAL SAFETY AND HEALTH STANDARDS
Published by DOL on July 1, 2014
Purpose and scope. (a) Section 6(a) of the Williams- Steiger Occupational Safety and Health Act of 1970 (84 Stat. 1593) provides that ‘‘without regard to chapter 5 of title 5, United States Code, or...
This document references:
40 CFR PART 117 - DETERMINATION OF REPORTABLE QUANTITIES FOR HAZARDOUS SUBSTANCES
Published by EPA on July 1, 2016
Definitions. As used in this part, all terms shall have the meanings stated in 40 CFR part 116.
This document references:
40 CFR PART 261 - IDENTIFICATION AND LISTING OF HAZARDOUS WASTE
Published by EPA on July 1, 2019
Purpose and scope. (a) This part identifies those solid wastes which are subject to regulation as hazardous wastes under parts 262 through 265, 268, and parts 270, 271, and 124 of this chapter and...
This document references:
40 CFR PART 302 - DESIGNATION, REPORTABLE QUANTITIES, AND NOTIFICATION
Published by EPA on July 1, 2019
A description is not available for this item.
This document references:
40 CFR PART 82 - PROTECTION OF STRATOSPHERIC OZONE
Published by EPA on July 1, 2018
Purpose and scope. The purpose of the regulations in this subpart is to implement the Montreal Protocol on Substances that Deplete the Ozone Layer and sections 602, 603, 604, 605, 606, 607, 614 and...
This document is referenced by:
IPC-SM-780 - Component Packaging and Interconnecting with Emphasis on Surface Mounting
Published by IPC on July 1, 1988
This document provides guidelines for surface mounting electronic parts, and for intermixing surface and through-the-board mounting techniques. In addition, it describes the types of materials and...
This document is referenced by:
IPC-FA-251 - Assembly Guidelines for Single-Sided and Double- Sided Flexible Printed Circuits
Published by IPC on February 1, 1992
This document provides guidelines for the assembly of components and mounting hardware to single-and double-sided flexible printed wiring. In addition, the guidelines describe the type of materials...
This document is referenced by:
IPC-CM-770 - Guidelines for Printed Board Component Mounting
Published by IPC on January 1, 2004
Chip-On-Flex (COF) – Surface mounted chip attached directly onto flexible printed boards. Chip-On-Glass (COG) – An assembly technology that uses an unpackaged semiconductor die mounted directly on a...
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