DLA - SMD-5962-94621

MICROCIRCUIT, LINEAR, +5 V, +12 V, +15 V STEP-UP, CURRENT MODE, PWM VOLTAGE REGULATOR, MONOLITHIC SILICON

inactive

Organization:	DLA
Publication Date:	21 June 1994
Status:	inactive
Page Count:	11

scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 MAX731 +5 V, step-up, current-mode, PWM voltage regulator 02 MAX732 +12 V, step-up, current-mode, PWM voltage regulator 03 MAX733 +15 V, step-up, current-mode, PWM voltage regulator

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 dual-in-line 2 CQCC1-N20 20 square chip carrier package

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (V+, LX to GND) . . . . . . . . . . . . . . 17 V, −0.3 V Output voltage (V_OUT) . . . . . . . . . . . . . . . . . . ±25 V Input voltage, (V_IN), [S bar][H bar][D bar][N bar], SS, CC . . . . . . −0.3 to (V+ + 0.3 V) Junction temperature (T_J) . . . . . . . . . . . . . . . . +150°C Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . . 300°C LX output current . . . . . . . . . . . . . . . . . . . . 1.5 A peak Reference current . . . . . . . . . . . . . . . . . . . . 2.5 mA Power dissipation, T_A = 70°C (P_D): Case outline P . . . . . . . . . . . . . . . . . . . . . 640 mW 2/ Case outline 2 . . . . . . . . . . . . . . . . . . . . . 727 mW 3/ Thermal resistance, junction-to-case (THgr;_JC): Case outline P . . . . . . . . . . . . . . . . . . . . . 55°C/W Case outline 2 . . . . . . . . . . . . . . . . . . . . . 55°C/W Thermal resistance, junction-to-ambient (THgr;_JA): Case outline p . . . . . . . . . . . . . . . . . . . . . 125°C/W Case outline 2 . . . . . . . . . . . . . . . . . . . . . 110°C/W

Ambient operating temperature range (T_A) . . . . . −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.

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