scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Address access time 01 V750 22-input 10-output 40 ns and-or-logic array 02 V750 22-input 10-output 35 ns and-or-logic array 03 V750 22-input 10-output 25 ns and-or-logic array 04 V750 22-input 10-output 20 ns and-or-logic array 06 V750L 22-input 10-output 35 ns and-or-logic array 07 V750L 22-input 10-output 25 ns and-or-logic array

The case outline(s) shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline L D-9 (24-lead, 1.280" × .310" × .200"), dual-in-line package 1/ 3 C-4 (28-terminal, .460" × .460" × .100"), square chip carrier package 1/ X F-16 (24-lead, .630" × .380" × .090"), flat pack 1/

Supply voltage range - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage range- - - - - - - - - - - - - - - - −2.0 V dc to +7.0 V dc 3/ Output voltage applied - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc 3/ Output sink current- - - - - - - - - - - - - - - - 16 mA Thermal resistance, junction-to-case (θ_JC) - - - - See MIL-M-38510, appendix C Maximum power dissipation (P_D) 4/ - - - - - - - - 1.2 W Maximum junction temperature - - - - - - - - - - - +175°C Lead temperature (soldering, 10 seconds maximum) - +300°C

Supply voltage (V_CC) - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc High level input voltage (V_IH) - - - - - - - - - - 2.0 V dc minimum Low level input voltage (V_IL)- - - - - - - - - - - 0.8 V dc maximum

intended Use: