scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 TLE2071 JFET-Input operational amplifiers 02 TLE2072 JFET-Input dual operational amplifiers 03 TLE2074 JFET-Input quad operational amplifiers

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Positive supply voltage (+V_CC) . . . . . . . . . . . . . . +19 V dc Negative supply voltage (−V_CC) . . . . . . . . . . . . . . −19 V dc Differential input voltage range 3/ . . . . . . . . . . . +V_CC to −V_CC Input voltage range, V_IN (any input) . . . . . . . . . . . +V_CC to −V_CC Input current, I_IN (each input) . . . . . . . . . . . . . ±1 mA Output current, I_OUT (each output) . . . . . . . . . . . . ±80 mA Total current into +V_CC terminal . . . . . . . . . . . . . 160 mA Total current out of −V_CC terminal . . . . . . . . . . . . 160 mA Duration of short-circuit current at (or below) +25°C 4/ . Unlimited Storage temperature range (T_STG) . . . . . . . . . . . . . −65°C to +150°C Maximum power dissipation (P_D): Case C . . . . . . . . . . . . . . . . . . . . . . . . . 1375 mW 5/ Case P . . . . . . . . . . . . . . . . . . . . . . . . . 1050 mW 5/ Case 2 . . . . . . . . . . . . . . . . . . . . . . . . . 1375 mW 5/ Lead temperature (soldering, 10 seconds) . . . . . . . . . +260°C Thermal resistance, junction-to-case (Θ_JC) . . . . . . . . See MIL-STD-1835 Junction temperature (T_J) . . . . . . . . . . . . . . . . +150°C

Supply voltage (±V_CC) . . . . . . . . . . . . . . . . . . ±2.25 V dc minimum ±19 V dc maximum Common-mode input voltage (V_IC): ±V_CC = ±5 V dc . . . . . −0.8 V dc minimum +5 V dc maximum ±V_CC = ±15 V dc . . . . −10.8 V dc minimum +15 V dc maximum Ambient operating temperature range (T_A) . . . . . . . . −55°C to +125°C

intended Use: