JEDEC JESD 22-B112
High Temperature Package Warpage Measurement Methodology
inactive
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| Organization: | JEDEC |
| Publication Date: | 1 May 2005 |
| Status: | inactive |
| Page Count: | 22 |
Document History
November 1, 2023
Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature
The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of thermal conditions experienced during the surface-mount...
August 1, 2018
Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature
The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of thermal conditions experienced during the surface-mount...
October 1, 2009
Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature
The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of environmental conditions experienced during the surface-mount...
JEDEC JESD 22-B112
May 1, 2005
High Temperature Package Warpage Measurement Methodology
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