DS/EN 60749-9
Semiconductor devices – Mechanical and climatic test methods – Part 9: Permanence of marking
inactive
| Organization: | DS |
| Publication Date: | 26 August 2002 |
| Status: | inactive |
| Page Count: | 11 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
The purpose of this part of IEC 60749 is to test and verify that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test should be considered non-destructive. Electrical or mechanical rejects may be used for the purpose of this test.
Document History
June 20, 2017
Semiconductor devices – Mechanical and climatic test methods – Part 9: Permanence of marking
IEC 60749-9:2017(E) is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and...
December 23, 2003
Semiconductor devices – Mechanical and climatic test methods – Part 9: Permanence of marking
The purpose of this part of IEC 60749 is to test and verify that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during...
DS/EN 60749-9
August 26, 2002
Semiconductor devices – Mechanical and climatic test methods – Part 9: Permanence of marking
The purpose of this part of IEC 60749 is to test and verify that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during...
Semiconductor devices – Mechanical and climatic test methods – Part 9: Permanence of marking
The purpose of this part of IEC 60749 is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of...
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