scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is be as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Toggle speed 01 14100A 10,000 gate, field programmable array 142.9 ns 02 14100A-1 10,000 gate, field programmable array 121.5 ns

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CMGA11-257C 257 1/ Pin grid array package Y See figure 1 256 Quad flat package

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range to ground potential (V_DD) - - - - - −0.5 V dc to +7.0 V dc Input voltage range - - - - - - - - - - - - - - - - - - - −0.5 V dc to V_DD +0.5 V dc Output voltage range - - - - - - - - - - - - - - - - - - −0.5 V dc to V_DD +0.5 V dc Lead temperature (soldering, 10 seconds) - - - - - - - - +300°C I/O Source/Sink current (I_IO) - - - - - - - - - - - - - - ±20 mA. Thermal resistance, junction-to-case (θ_JC): Case outline X - - - - - - - - - - - - - - - - - - - - See MIL-STD-1835 Case outline Y - - - - - - - - - - - - - - - - - - - - 13°C/W 3/ Junction temperature (T_J) - - - - - - - - - - - - - - - - +150°C 4/ Storage temperature range - - - - - - - - - - - - - - - - −65°C to +150°C

Case operating temperature Range(T_C) - - - - - - - - - - −55°C to +125°C Supply voltage relative to ground(V_DD) - - - - - - - - - +4.5 V dc minimum to +5.5 V dc maximum Ground voltage (GND) - - - - - - - - - - - - - - - - - - 0 V dc

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - 6/ percent

intended Use: