DLA - SMD-5962-96658
MICROCIRCUIT, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, HEX SCHMITT-TRIGGER INVERTERS, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 6 November 1995 |
| Status: | inactive |
| Page Count: | 13 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 54LS14 hex schmitt-trigger inverters
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style C CDIP2-T14 or GDIP1-T14 14 dual-in-line package D CDFP2-F14 or GDFP1-F14 14 flat package 2 CQCC1-N20 20 leadless chip carrier
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range (VCC). . . . . . . . . . . . . . . . . . . 0.5 V dc minimum to +7.0 V dc maximum Input voltage range . . . . . . . . . . . . . . . . . . . . . . 1.5 V dc at −18 mA to +7.0 V dc Storage temperature range . . . . . . . . . . . . . . . . . . . −65°C to +150°C Thermal resistance, junction-to-case (ΘJC) . . . . . . . . . . See MIL-STD-1835 Junction temperature (TJ) . . . . . . . . . . . . . . . . . . . +175°C Lead temperature (soldering, 10 seconds). . . . . . . . . . . . +300°C Maximum power dissipation (PD). . . . . . . . . . . . . . . . . 115 mW
Supply voltage range (VCC). . . . . . . . . . . . . . . . . . . +4.5 Vdc minimum to +5.5 V dc maximum Minimum high level output current (ION) . . . . . . . . . . . . −0.4 mA Maximum low level output current (IOL). . . . . . . . . . . . . 4 mA Maximum input clamp current (IIK) . . . . . . . . . . . . . . . −1.5 V Case operating temperature range (TC) . . . . . . . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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