scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and Lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes m, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Frequency 01 TMC2310V CMOS 16/19-bit FFT Controller and Arithmetic Unit 15 MHz 02 TMC2310V1 CMOS 16/19-bit FFT Controller and Arithmetic Unit 20 MHz

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline Letter Descriptive designator Terminals Package style X See figure 1 88 Pin grid array package Y See figure 1 100 Flat package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish Letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when Lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range . . . . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc Input voltage range. . . . . . . . . . . . . . . . . . . −0.5 V dc to V_DD + 0.5 V dc Applied output voltage range 2/ . . . . . . . . . . . . −0.5 V dc to V_DD + 0.5 V dc Forced output current range 3/, 4/ . . . . . . . . . . . −3.0 mA to +6.0 mA Output short circuit duration 5/ . . . . . . . . . . . 1.0 second Power dissipation, unloaded (P_D) 6/ . . . . . . . . . . 880 mW Lead temperature (soldering, 10 seconds) . . . . . . . . +300°C Thermal resistance, junction-to-case (Θ_JC): Case outline X . . . . . . . . . . . . . . . . . . . 12°C/W Case outline Y . . . . . . . . . . . . . . . . . . . 9°C/W Junction temperature (T_J) . . . . . . . . . . . . . . . +175°C Storage temperature range . . . . . . . . . . . . . . . −65°C to +150°C

Supply voltage range (V_DD) . . . . . . . . . . . . . . . . 4.5 V dc to 5.5 V dc Input low voltage (V_IL) . . . . . . . . . . . . . . . . . 0.8 V dc maximum Input high voltage (V_IH) . . . . . . . . . . . . . . . . 2.0 V dc minimum Input high voltage, clock (V_IHC) . . . . . . . . . . . . . 2.3 V dc minimum Output low current (I_OL) . . . . . . . . . . . . . . . . 4.0 mA maximum Output high current (I_OH) . . . . . . . . . . . . . . . . −2.0 mA maximum Operating case temperature range (T_C) . . . . . . . . . . −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . . . . . XX percent 7/

intended Use: