DLA - SMD-5962-94681
MICROCIRCUIT, LINEAR, +10 V VOLTAGE REFERENCE, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 14 June 1994 |
| Status: | inactive |
| Page Count: | 10 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 MAX674 +10 V voltage reference
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style G MACY1-X8 8 can P GDIP1-T8 or CDIP2-T8 8 dual-in-line 2 CQCC1-N20 20 square chip carrier package
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage (VIN) . . . . . . . . . . . . . . . . . . 40 V Output short-current duration (to GND or VIN) . . . . . Indefinite Storage temperature range . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . 300°C Junction temperature (TJ) . . . . . . . . . . . . . . . +150°C Power dissipation, TA = 70°C (PD): Case outline G . . . . . . . . . . . . . . . . . . . . 533 mW 2/ Case outline P . . . . . . . . . . . . . . . . . . . . 640 mW 3/ Case outline 2 . . . . . . . . . . . . . . . . . . . . 727 mW 4/ Thermal resistance, junction-to-case (ΘJC): Case outline G . . . . . . . . . . . . . . . . . . . . . 45°C/W Case outline P . . . . . . . . . . . . . . . . . . . . . 55°C/W Case outline 2 . . . . . . . . . . . . . . . . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (ΘJA): Case outline G . . . . . . . . . . . . . . . . . . . . . 150°C/W Case outline P . . . . . . . . . . . . . . . . . . . . . 125°C/W Case outline 2 . . . . . . . . . . . . . . . . . . . . . 110°C/W
Input voltage range (VS . . . . . . . . . . . . . . . . 2.0 V to 16.5 V Ambient operating temperature range (TA) . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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