scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lad finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Toggle Speed 01 3020-50 8×8 2000 gate programmable array 50 MHz 02 3020-70 8×8 2000 gate programmable array 70 MHz 03 3020-100 8×8 2000 gate programmable array 100 MHz 04 3020-125 8×8 2000 gate programmable array 125 MHz

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and Qualification to MIL-I-38535

The case outlines shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CMGA15-PN 84 1/ Pin grid array package Y See figure 1 100 Quad flat package Z CMGA3-PN 84 1/ Pin grid array package U CQCCI-F100 100 Unformed-lead chip carrier 2/ T See figure 1 100 Quad flat package M See figure 1 100 Quad flat package N See figure 1 100 Quad flat package 9 See figure 1 100 Quad flat package

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range to ground potential (V_CC) - - - - - - - - - −0.5 V dc to +7.0 dc DC input voltage range - - - - - - - - - - - - - - - - - - - - - −0.5 V dc to V_CC +0.5 V dc Voltage applied to three-state output(V_TS) - - - - - - - - - - - −0.5 V dc to V_CC +0.5 V dc Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - +260°C Thermal resistance, junction-to-case (Θ_JC): Case outline X, Z, and U - - - - - - - - - - - - - - - - - See MIL-STD-1835 Case outlines Y, T, M, N, and 9 - - - - - - - - - - - - - - 10°C/W 4/ Junction temperature (T_J) - - - - - - - - - - - - - - - - - - - - +150°C 5/ Storage temperature range - - - - - - - - - - - - - - - - - - - - −65°C to +150°C

Case operating temperature Range(T_C)- - - - - - - - - - - - - - - −55°C to +125°C Supply voltage relative to ground(V_CC)- - - - - - - - - - - - - - +4.5 V dc minimum to +5.5 V dc maximum Ground voltage (GND) or (V_SS) - - - - - - - - - - - - - - - - - - 0 V dc

Fault coverage measurement of manufacturing logic tests in accordance with MIL-I-38535 - - - - - - - - - - - 95 percent

intended Use: