scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The complete PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Propagation delay 01 24-Macrocell EPLD 35 ns 02 24-Macrocell EPLD 25 ns 03 24-Macrocell EPLD 20 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style Q GDIP1-T40, CDIP2-T40 40 Dual-in-line package 2/

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) - - - - - - - - - - - −2.0 V dc to +7.0 V dc Programming supply voltage range (V_PP) - - - - - −2.0 V dc to +13.5 V dc 4/ DC input voltage range - - - - - - - - - - - - - −0.5 V dc to V_CC + 0.5 V dc 4/ Maximum power dissipation - - - - - - - - - - - 1.0 W 5/ Lead temperature (soldering, 10 seconds) - - - - +275°C Thermal resistance, junction-to-case (θ_JC): Case outline Q - - - - - - - - - - - - - - - See MIL-STD-1835 Junction temperature (T_J) - - - - - - - - - - - +150°C Storage temperature range - - - - - - - - - - - −65°C to +150°C Temperature under bias range - - - - - - - - - - −55°C to +125°C 6/ Endurance - - - - - - - - - - - - - - - - - - - 25 erase/write cycles (minimum) Data retention - - - - - - - - - - - - - - - - - 10 years (minimum)

Supply voltage range (V_CC) - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Ground voltage (GND) - - - - - - - - - - - - - - - 0 V dc Input high voltage (V_IH) - - - - - - - - - - - - - 2.0 V dc minimum Input low voltage (V_IL) - - - - - - - - - - - - - 0.8 V dc maximum Case operating temperature range (T_C) - - - - - - −55°C to +125°C 6/ Input rise time (t_R) - - - - - - - - - - - - - - - 500 ns maximum Input fall time (t_F) - - - - - - - - - - - - - - - 500 ns maximum

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012)- - - - - - XX percent 7/

intended Use: